09:01
2026-09-02
me.mashable.com
artificial-intelligence
Xiaomi 18 Fold’s XRING O3 chip hits record Geekbench, 3DMark highs, putting Google's Tensor behind
Xiaomi's custom XRING O3 chip, fabricated on TSMC's N3P process, has achieved record benchmark scores, with Geekbench 6 multi-core reaching 15,221 points and AnTuTu V11 scoring 5.22 million, surpassin…