AMD introduced the CDNA 5 architecture, the Instinct MI455X GPU with 432 GB HBM4 memory and up to 4x greater AI compute throughput, and the Helios rackscale solution that unifies 72 GPUs into a single…
Supermicro introduced its H15 server portfolio built on 6th Gen AMD EPYC 9006 Series CPUs, featuring up to 256 cores per socket and 1.7x generational performance gains, alongside new PCIe GPU servers …
AMD and Schneider Electric have jointly released the first reference design for AMD's Helios rackscale AI platform, providing a validated blueprint for data center developers covering facility power, …
Schneider Electric and AMD released a jointly developed reference design for the AMD Helios rackscale solution to accelerate AI factory deployment. The design supports high-density AI workloads up to …
AMD has introduced the EPYC 9006 'Venice-LP' processor, a purpose-built enterprise CPU for rack-scale AI solutions that competes directly with NVIDIA's Vera CPU. The chip features a 72-core/144-thread…
AMD Chair and CEO Dr. Lisa Su announced at Lenovo Tech World '26 that Lenovo is one of the earliest OEM adopters of the AMD Helios rack-scale solution, a platform combining 72 AMD Instinct MI455X GPUs…
AMD CEO Lisa Su unveiled the Helios AI platform at a San Francisco event to compete with Nvidia's Vera Rubin, claiming AMD has an edge in efficiency and cost. The platform includes the new Instinct MI…
AMD CEO Lisa Su said the AI accelerator market is growing at a 45% compound annual growth rate from $200 billion in 2025 to $1.4 trillion by 2030, up from her previous estimate of $500 billion. Su ann…
AMD and Anthropic announced a strategic partnership to deploy up to 2 gigawatts of AMD Instinct MI450 Series GPUs in AMD Helios rackscale solutions, with the first gigawatt deployment beginning in the…
AMD announced an expanded strategic partnership with Microsoft to deploy the AMD Helios Rackscale Solution on Microsoft Azure, powering frontier model AI inference for Microsoft and its Azure AI servi…
Sophon PFG-1, a monolithic-3D AI ASIC with 330 GB of on-die DRAM and no HBM, delivers 2,100 TFLOPS BF16 and 4,200 TFLOPS FP8 on a 750 mm² die, achieving up to 174× the tokens-per-watt of NVIDIA Rubin …