F5 demonstrated its BIG-IP Next for Kubernetes (BNK) application delivery and security stack running on NVIDIA BlueField-3 DPUs in a sponsored lab tour in California, positioning the software between …
NVIDIA launched its DSX Ready qualification program for data center power and cooling hardware, covering battery energy storage systems (BESS) and cooling distribution units (CDUs) that NVIDIA does no…
ServeTheHome editor Patrick Kennedy logged 26 flights in 46 days and expects to pass 70 flights by the end of Q3 2026, after previously vowing to avoid repeating 2025's 98 flights. The Q3 2026 letter …
Onsemi announced its Embedded Power Platform (EPP) at its investor day, a power-integration approach that embeds heterogeneous power dies into silicon and connects them through wafer-level redistribut…
D-Matrix announced it will bring its next-generation XPUs to NVIDIA's NVLink Fusion platform, scaling the company's Raptor accelerators beyond a single XPU into MGX racks. The deployment also uses NVI…
Qualcomm disclosed details of its next-generation premium Snapdragon platform's Oryon CPU, Adreno GPU, and Hexagon NPU ahead of its Snapdragon Summit later this month. The Oryon CPU's two Prime cores …
AMD announced the Threadripper Halo Station, a high-end AI-centric developer workstation, at the IFA tech convention in Berlin. The tower system pairs a Threadripper Pro 9995WX CPU with up to four liq…
At Hot Chips 2026, NVIDIA detailed its plans to bring RISC-V CPUs into its GPU platforms, outlining requirements for CUDA and NVLink Fusion integration. The company highlighted RVA23 profiles and the …
NVIDIA announced the Jetson Orin Nano 2, an entry-level edge AI board with new Ampere silicon that delivers a 2x increase in AI performance or similar performance at 40% less power, with 78 TOPS of IN…
Cisco announced that its Secure AI Factory with NVIDIA is expanding to rack-scale infrastructure built around Supermicro liquid-cooled and air-cooled systems, with availability beginning in October th…
Oxmiq Labs presented high-bandwidth flash (HBF) as a capacity tier for AI inference at Hot Chips 2026, claiming it delivers 8 to 16 times the capacity of HBM at the same cost. The company detailed HBF…
Apple Inc. launched the Mac Studio with the M5 Ultra and the Mac mini with the M6, marking the company's first 2 nm desktop chip and a quad-die design supporting up to 512GB of unified memory for loca…
OpenAI unveiled Jalapeño, an in-house inference ASIC and system built with Broadcom, at Hot Chips 2026, claiming it outperforms NVIDIA GB200 and GB300 in throughput per kilowatt and latency for OpenAI…
Google announced its eighth-generation tensor processor units (TPUs), the TPU 8t for training and TPU 8i for inference, at Hot Chips 2026, marking the first time the company has released two TPU gener…
SambaNova Systems presented technical details of its fifth-generation SN50 reconfigurable dataflow unit (RDU) at Hot Chips 2026, claiming it delivers 5x the FLOPS of the SN40 and scales to 256+ chips.…
Microsoft unveiled the architecture of its second-generation Maia 200 AI accelerator at Hot Chips 2026, a 3nm chip with 140 billion transistors, 750W TDP, and 10,000 TFLOPS of FP4 performance, designe…
NVIDIA announced at Hot Chips 2026 that its Vera Rubin racks will incorporate Groq 3 LPU accelerators, purchased from Groq as part of an acquihire, to boost low-latency decode performance for agentic …
Meta Platforms Inc. presented its Meta Training and Inference Accelerators (MTIA) custom AI silicon at Hot Chips 2026, detailing a roadmap of four generations (MTIA 300, 400, 450, 500) to reduce relia…
NVIDIA presented its Spectrum-X Ethernet Multiplane Network Architecture at Hot Chips 2026, claiming 1.9x higher training performance in multi-tenant AI factories and detailing a roadmap to scale AI f…
NVIDIA unveiled the BlueField-4 DPU at Hot Chips 2026, a fourth-generation data center processor co-designed into the Vera Rubin platform, featuring ConnectX-9-class networking and Grace CPU-class cor…