Xiaomi unveils Xring O3 as it expands in-house chip push

Xiaomi unveiled its second in-house smartphone processor, the Xring O3, as it seeks greater control over key components and reduced reliance on external suppliers. TSMC is expected to manufacture the chip using a 3-nanometer process, and Xiaomi said devices powered by its first Xring O1 processor had surpassed 1 million cumulative shipments. The company has also contracted TSMC to produce the Xring O100 AI chip and Xring D100 autonomous-driving chip.