Celestica DS6005 Puts 102.4Tbps of Co-Packaged Optics and 64 1.6TbE Ports in a 1.5OU Liquid-Cooled ORv3 Switch

Celestica introduced the DS6005 at the OCP Global Summit, a co-packaged optics (CPO) data center switch that puts 102.4Tbps of switching capacity and 64 optically enabled 1.6TbE ports in a 1.5OU, fully liquid-cooled chassis for Open Rack v3. It is built on Broadcom’s Tomahawk 6 Davisson, the CPO version of the 102.4T Tomahawk 6, which integrates the optical engines onto the switch package so the front panel carries fiber connectors and laser modules in place of pluggable transceivers. Celestica is aiming it at AI/ML scale-up and scale-out fabrics.

The DS6005 lands in the same week as two other Tomahawk 6 CPO systems. Micas Networks put Davisson in a 1RU box with a Q1 2027 production date, and Supermicro’s 2OU CPO switch takes busbar power in an ORv3 rack. Celestica’s version is the one built for the OCP high-power rack from the start, with liquid cooling as the only cooling option and a chassis labeled for 46 to 56V DC input at 76A on the rear.

Optical Engine Integration #

Co-packaging moves the optical engines from the faceplate onto the Tomahawk 6 Davisson package, which Celestica says removes the discrete digital signal processors and the long copper traces between the ASIC and a pluggable module, cutting link-level power and latency.

The lasers stay outside the package: the DS6005 carries 16 ELSFP external laser modules on the front panel that can be swapped in the field, so a failed laser does not take the switch out of service, and the 64 1.6TbE ports terminate in 16 MMC-16 fiber connectors. Celestica also cites CPO-aware software management for the platform, though it has not described what that covers.

“AI infrastructure is driving unprecedented demand for bandwidth, while power, thermal management, latency, and reach are becoming increasingly important constraints,” said Gavin Cato, SVP & GM Portfolio Solutions & AI Platform Engineering at Celestica. “The DS6005 brings co-packaged optics, liquid cooling, field-replaceable external laser modules, and CPO-aware software management together in a compact platform designed to help customers build scalable and power-efficient AI fabrics.”

Celestica has not published power or latency figures for the DS6005, so the savings over a pluggable-optics switch remain something to investigate further. Broadcom’s Manish Mehta, vice president of marketing and operations for its Optical Systems Division, said the partnership covers silicon, optical engines, packaging, thermal design, manufacturing, and system integration, and Dell’Oro Group’s Sameh Boujelbene noted in the same announcement that pluggable, near-package, and co-packaged optics will coexist as the ecosystem matures.

Thermal Management #

The DS6005 is fully liquid-cooled in a 1.5OU chassis for ORv3-HPR, the OCP high-power rack, with the coolant quick-disconnects and the DC input on the rear panel. Celestica says the cooling keeps switch-level temperature stable, which improves reliability and allows denser racks, and its product page claims the design prevents thermal throttling. Beyond the switch ASIC and optics, the system runs an AMD Ryzen x86 host CPU with a BMC, carries TPM 2.0, a hardware root of trust, and post-quantum cryptography support, and has IEEE 1588 and SyncE timing hardware.

The switch runs SONiC with ONIE for installation, though Celestica has not named a SONiC release, and its specifications are preliminary and subject to change. The announcement and product documentation do not give sampling, shipping, or general-availability dates.

| **Form Factor** | 1.5OU, ORv3-HPR (High Power Rack) | 
| **Power Input** | 46 to 56V DC, 76A (rear-panel label) | 

| Cooling | Fully liquid-cooled | | Software | SONiC Open Network Install Environment (ONIE) | | Environmental Compliance | RoHS compliant |