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Integrated Package Solution (iPaS)

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09:00

2026-09-14

asiaai.fyi

ai-chips

Murata’s iPaS Substrates: Solving the Power Delivery Bottleneck in AI Accelerators

Murata Manufacturing, the world's largest producer of Multi-Layer Ceramic Capacitors (MLCCs), plans to mass-produce its Integrated Package Solution (iPaS) next year, integrating passive components suc…

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Murata Manufacturing 1 Multi-Layer Ceramic Capacitors (MLCCs) 1 Vertical Power Delivery (VPD) 1 TechNews 1

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ai chips 1 ai infrastructure 1