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EETimes

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13:00
2026-08-26
eetimes.com
artificial-intelligence

From Days to Minutes: Accelerating 3D IC Debug with Agentic AI

Agentic AI is accelerating 3D IC debugging from days to minutes, addressing a bottleneck where first-silicon success rates are below 15% and debugging consumes roughly half of verification effort. The…

13:00
2026-08-05
eetimes.com
artificial-intelligence

Safeguarding Fab Throughput with AI-Augmented Data Insights

Semiconductor fabs face an execution mandate as demand for AI infrastructure locks in capacity years ahead, with leading-edge foundry capacity pre-booked through 2028. The bottleneck is diagnosing yie…

19:00
2026-07-20
eetimes.com
artificial-intelligence

UMA: The Architecture Edge AI Needs to Scale

Edge AI workloads, particularly reasoning models and agentic systems, fail when memory capacity is exhausted, a problem traditional architectures cannot solve, according to a technical analysis by EE …

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