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13:00
2026-08-26
eetimes.com
artificial-intelligence · 5m read ↑ pos

From Days to Minutes: Accelerating 3D IC Debug with Agentic AI

Agentic AI is accelerating 3D IC debugging from days to minutes, addressing a bottleneck where first-silicon success rates are below 15% and debugging consumes roughly half of verification effort. The technology tackles …

13:00
2026-08-26
hiraditya.github.io
ai-infrastructure · 8m read · neu

Heterogeneity Moved Inside the Chip

At Hot Chips 2026, OpenAI presented Jalapeño, an inference ASIC built with Broadcom, which integrates heterogeneous compute, memory, and network resources on a single chip to handle the three phases of a request—prefill,…

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