Zhen Ding Joins Nvidia MGX: Cable-Free PCB Technology Replaces Copper Cables in AI Server Factories

Taiwan's Zhen Ding Technology has joined Nvidia's MGX ecosystem to supply cable-free PCB-based interconnect technology that replaces hundreds of individual copper cables in AI server racks. The approach uses high-layer-count PCB backplanes carrying 112 Gbps PAM4 signals between GPU modules, eliminating discrete cables in densely packed 80-100kW racks. This partnership between the world's third-largest PCB maker and Nvidia shifts AI server rack wiring to a cable-free architecture, increasing PCB value per rack by 2-3×.

Taiwan's Zhen Ding Technology just announced something that should interest anyone building AI infrastructure: they've joined Nvidia's MGX Modular GPU eXpress ecosystem to supply cable-free PCB-based interconnect technology. Instead of hundreds of individual copper cables connecting GPU modules in a server rack, the new approach uses high-layer-count PCB backplanes to carry 112 Gbps PAM4 signals between compute modules. This is a fundamental architectural shift in how AI server racks are wired. A modern AI training cluster has thousands of GPU-to-GPU connections running NVLink at 100+ Gbps per lane. Each connection traditionally uses either: In a densely packed 80-100kW GPU rack, these cables create multiple problems: Zhen Ding's cable-free approach replaces discrete cables with PCB backplanes/midplanes that are pre-manufactured with all interconnects integrated. Think of it as a giant multi-layer PCB that sits between server modules, carrying signals directly through impedance-controlled traces. Based on publicly available information about MGX-class backplanes: | Parameter | Requirement | |---|---| | Layer count | 30–60+ layers | | Signal speed | 112 Gbps PAM4 per lane | | Impedance tolerance | ±5% on 85Ω differential | | Board thickness | 6–10mm | | Board length | 600–1000mm | | Material | Very low-loss Dk 3.0, Df 0.002 | | Copper foil | ULVP Rz < 1.5µm | | Via technology | Sequential lamination + laser drill + backdrill | These are among the most challenging PCBs manufactured anywhere. The combination of extreme layer count, very-low-loss materials, ultra-smooth copper, and ±5% impedance over 600+ mm lengths pushes every aspect of PCB fabrication to its limits. Nvidia's GB200 NVL72 racks and future Rubin-based systems push interconnect density to levels where discrete cables become impractical: The MGX modular architecture is designed so compute trays slide into a pre-wired chassis — cable-free by design. This trend dramatically increases PCB value per AI server rack: That's a 2-3× increase in PCB dollar content per rack, and AI data center buildout is accelerating. For the PCB industry, this represents a significant structural demand driver. If you're working on AI infrastructure: Material selection is critical — Standard FR-4 cannot meet Df < 0.003 at 28 GHz. You need Megtron 7, Tachyon, or equivalent ultra-low-loss laminates. Copper roughness matters — At 56 GHz 112G PAM4 Nyquist , standard copper foil can double your conductor loss vs. ULVP. Budget 0.8-1.2 dB/inch difference. Via transitions are the bottleneck — Every layer change needs carefully designed anti-pads, back-drilled stubs, and return-path vias. 3D electromagnetic simulation is mandatory. Fabricator qualification is essential — Not all fabricators can hold ±5% impedance on 40+ layer stackups with mixed-sequential lamination. Verify capability with test coupons before committing production. Lead times are long — 6-12 weeks for this class of board. Plan accordingly. This partnership between Zhen Ding world's 3rd largest PCB maker and Nvidia further concentrates the AI hardware supply chain in Taiwan. With TPCA projecting Taiwan PCB output exceeding NT$1 trillion US$33.5B in 2026, the industry's center of gravity continues to shift toward AI-driven applications. For hardware teams outside the hyperscaler ecosystem, the takeaway is that advanced PCB manufacturing capacity is being absorbed by AI infrastructure demand. Securing capacity for complex boards 12+ layers, low-loss materials requires earlier planning and potentially premium pricing. Source: DIGITIMES, June 2, 2026 Originally published at AtlasPCB