Xiaomi unveils Xring O3 as it expands in-house chip push

Xiaomi unveiled its second in-house smartphone processor, the Xring O3, as it seeks greater control over key components and reduced reliance on external suppliers. TSMC is expected to manufacture the chip using a 3-nanometer process, and Xiaomi said devices powered by its first Xring O1 processor had surpassed 1 million cumulative shipments. The company has also contracted TSMC to produce the Xring O100 AI chip and Xring D100 autonomous-driving chip.

Xiaomi unveiled its second in-house smartphone processor, the Xring O3, as it seeks greater control over key components and reduced reliance on external suppliers. TSMC is expected to manufacture the chip using a 3-nanometer process. Xiaomi said devices powered by its first Xring O1 processor had surpassed 1 million cumulative shipments. The company has also contracted TSMC to produce the Xring O100 AI chip and Xring D100 autonomous-driving chip. Reuters https://m.investing.com/news/stock-market-news/xiaomi-launches-new-xring-chip-partners-with-tsmc-for-production-sources-say-4872712?ampMode=1