Xiaomi targets Apple and Qualcomm with custom XRING O3 chip: Check full specs

Xiaomi has launched its custom XRING O3 system-on-chip, manufactured on TSMC's 3nm N3P process, featuring a 10-core CPU with Arm C1-Ultra cores up to 4.35GHz, a 16-core G2-Ultra GPU, and a 200 TOPS NPU, achieving a record AnTuTu V11 score of 5,228,014 and first-in-class native LPDDR6 support, ahead of its debut in the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max. The chip delivers up to 85% faster peak rendering and 182% faster ray tracing while cutting power consumption by 64% versus the XRING O1, positioning Xiaomi to compete with Apple and Qualcomm in flagship mobile silicon.

In a major bid for semiconductor self-reliance following Apple /tech/75092/inside-the-a20-pro-chip-leaked-benchmarks-reveal-18-performance-leap-on-iphone-18-pro , Google /tech/70575/google-pixel-11s-tensor-g6-chipset-may-offer-underwhelming-gpu-performance-leak-reveals , and partially Samsung, Xiaomi has formally launched its next-generation custom flagship system-on-chip: the XRING O3. Manufactured on TSMC /tech/56597/tsmc-is-keen-on-building-a-chip-manufacturing-plant-in-the-uae-heres-everything-you-need-to-know-abo ’s cutting-edge 3nm N3P process, the new platform skips iterative steps following last year's XRING O1 to deliver massive performance and efficiency upgrades across computing /tech/73259/why-quantum-computing-may-be-the-white-houses-new-ai , gaming, and neural processing. Squeezing 24 billion transistors into a compact 133mm² die, the XRING O3 establishes several commercial mobile firsts–including first-in-class native LPDDR6 integration and a landmark multi-core synthetic benchmark score–ahead of its official device debut on the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max. How is XRing Processor so powerful? The XRING O3 completely discards traditional low-power efficiency cores in favor of a heavy-hitting 10-core deca-core config, which is arranged in a 2 + 4 + 4 topology. The cluster is led by two ultra-performance Arm C1-Ultra Prime cores reaching clock speeds of up to 4.35GHz, backed by four C1-Premium cores running at 3.68GHz and four C1-Pro performance cores at 3.15GHz. Xiaomi just announced its next-generation silicon Xring O3. — Ishan Wankhade @IshanWankhade And this one isn't just about a faster smartphone chip. 🔺The Xring O3 packs: • 10-core CPU • Up to 4.35GHz C1-Ultra cores • 16-core G2-Ultra GPU • 200 TOPS NPU • Built on TSMC 3nm • 5.22M+ AnTuTu score • LPDDR6… pic.twitter.com/Ey0jiPW6Ss August 24, 2026 Supported by dual SME2 acceleration units, the platform delivers an officially claimed 5,228,014 points on the AnTuTu V11 benchmark–making it the first mobile processor to officially cross the 5-million-point threshold. On Geekbench /tech/72984/samsung-galaxy-s26-fe-spotted-on-geekbench-with-android-17-and-8gb-of-ram 6.5 testing, the chip achieved 3,945 points in single-core and 15,221 points in multi-core performance, rivaling desktop-tier processors in peak compute throughput. High-Efficiency 16-Core graphics with neural frame generation Graphical workloads are driven by an upgraded 16-core Arm G2-Ultra NX GPU running at 1.6GHz. According to Xiaomi /tech/67745/xiaomi-17-launches-alongside-xiaomi-tag-watch-5-and-more , the graphics subsystem provides up to an 85% boost in peak rendering throughput while reducing overall power consumption by 64% compared to the XRING O1, indirectly increasing battery backup while performing graphics-intensive tasks. What’s more remarkable is that hardware ray-tracing also sees an increase in performance- not measly 1-2% but a whopping 182% increase, highlighted by a score of 3,628 in 3DMark Solar Bay Extreme. The GPU also incorporates 8 dedicated NX neural network accelerators, enabling hardware-level AI super-resolution and frame interpolation for intensive gaming titles. World's first mobile platform with LPDDR6 RAM Memory bandwidth remains one of the largest bottlenecks for on-device generative AI and real-time graphics rendering. The XRING O3 is the first mobile smartphone /tech/73773/samsung-overtakes-apple-to-become-the-number-one-smartphone-brand-in-the-world platform to feature native support for next-generation LPDDR6 memory. Operating on a 4 × 24-bit memory bus at 10,667Mbps, the architecture outputs 113.8 GB/s of bandwidth–a 48% jump over standard LPDDR5X. Combined with a 16MB system-level cache SLC , memory latency drops to an industry-leading 82ns. 🚨The launch of the day — Neil Shah @neil shah @Xiaomi just unveiled the Xring O100 玄戒O100 - first dedicated high-bandwidth AI accelerator for edge large models - Vertically stacks a 6nm NPU compute wafer with dual high-speed DRAM memory wafers Wafer-on-Wafer 3D stacking . - Uses advanced… pic.twitter.com/FLVzD8SYnI August 24, 2026 What’s Unified Ecosystem Silicon For AI, Xiaomi’s new chip features a reconstructed 4-core Neural Processing Unit NPU delivering 200 TOPS of tensor performance and 3.13 TFLOPS of vector compute specifically optimized for Xiaomi’s on-device MiMo large language models. AI processing is further distributed across the CPU and GPU to streamline edge reasoning. Alongside the XRING O3, Xiaomi showcased two companion chips: the XRING O100, an AI accelerator with 3D wafer-level memory stacking yielding 1.22TB/s bandwidth, and the XRING D100, a 3nm automotive AI processor sporting 20 CPU cores and 160GB of unified memory designed for smart driving systems by 2027. Xiaomi has confirmed that the XRING O3 will make its official mass market debut in September 2026. The chipset will power the company's next flagship book-style foldable, the Xiaomi 18 Fold /tech/75310/xiaomis-most-powerful-in-house-processor-will-be-featured-in-its-next-book-style-foldable , as well as the high-end Xiaomi Pad 9 Pro Max tablet for the starters. While mainstream flagship and regular line phones will continue to utilize silicon from Qualcomm and MediaTek, the debut of the XRING O3 positions Xiaomi as a formidable silicon designer capable of competing head-to-head with the mobile industry's established semiconductor leaders. Feature image credits to Xiaomi. 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