The Next-Generation Memory Architecture in the AI Era? SK hynix Charts the Direction at ‘FMS 2026’

At FMS 2026, SK hynix presented its next-generation memory architecture for the AI era, unveiling the first HBF standard specifications with Sandisk and showcasing AI memory solutions including CXL, DRAM, HBM, NAND, and SSD. The company also highlighted its CTI innovation advancing 176-layer 3D NAND toward mass production, and expanded its strategic partnership with NVIDIA across AI factories and next-generation memory.

IMAGE & VIDEO Download The Next-Generation Memory Architecture in the AI Era? SK hynix Charts the Direction at ‘FMS 2026’ August 7, 2026 The Next-Generation Memory Architecture in the AI Era? SK hynix Charts the Direction at ‘FMS 2026’ August 7, 2026 TECH&AI CXLDRAMFMSHBFHBMNANDSSD SK hynix Unveils First HBF Standard Specifications with Sandisk, Presenting AI Memory Solutions at ‘FMS 2026’ August 4, 2026 PRESS 4D NANDAI MemoryFMSHBFSandiskStorage SK Group and NVIDIA Expand Strategic Partnership Across AI Factories and Next-Generation Memory July 25, 2026 PRESS AI MemoryDSXHBMNVIDIAPartnership Inside the Research SK hynix’s CTI innovation advances 176-layer 3D NAND toward mass production July 22, 2026 TECH&AI 176 layer NANDCTIIEDMIEEENANDResearch InsideScaling The Next-Generation Memory Architecture in the AI Era? SK hynix Charts the Direction at ‘FMS 2026’ August 7, 2026 TECH&AI CXLDRAMFMSHBFHBMNANDSSD SK hynix Unveils First HBF Standard Specifications with Sandisk, Presenting AI Memory Solutions at ‘FMS 2026’ August 4, 2026 PRESS 4D NANDAI MemoryFMSHBFSandiskStorage SK Group and NVIDIA Expand Strategic Partnership Across AI Factories and Next-Generation Memory July 25, 2026 PRESS AI MemoryDSXHBMNVIDIAPartnership Inside the Research SK hynix’s CTI innovation advances 176-layer 3D NAND toward mass production July 22, 2026 TECH&AI 176 layer NANDCTIIEDMIEEENANDResearch InsideScaling