SK hynix’s Indiana Packaging Plant: The 2029 Timeline for U.S. Chip Designers

SK hynix plans to start mass production of advanced packaging at its new US plant in Indiana by 2029, marking its first advanced packaging site in the US. The facility aims to support the local AI ecosystem and reinforce its supply chain for high bandwidth memory (HBM), responding to increasing demand from US-based AI chip designers and mitigating geopolitical risks.

SK hynix’s Indiana Packaging Plant: The 2029 Timeline for U.S. Chip Designers SK hynix plans to start mass production of advanced packaging at its new US plant in Indiana by 2029. AsiaAI Publisher · August 30, 2026 · 2 min read · Source: 더일렉 THE ELEC Semiconductors & Hardware SK hynix plans to start mass production of advanced packaging at its new US plant in Indiana by 2029. This facility, which will be the company’s first advanced packaging site in the US, aims to support the local AI ecosystem and reinforce its supply chain for high bandwidth memory HBM . This move directly responds to increasing demand for HBM, especially from US-based AI chip designers. Establishing a US packaging base helps SK hynix mitigate geopolitical risks and localize a critical part of its semiconductor supply chain, which has significant implications for national security and economic policy in both the US and South Korea.