# SK Hynix holds groundbreaking ceremony for $4B HBM packaging facility at Purdue

> Source: <https://www.reuters.com/world/asia-pacific/sk-hynix-holds-groundbreaking-ceremony-4-billion-indiana-ai-chip-packaging-2026-08-27/>
> Published: 2026-08-27 15:38:54+00:00

Article URL: https://www.reuters.com/world/asia-pacific/sk-hynix-holds-groundbreaking-ceremony-4-billion-indiana-ai-chip-packaging-2026-08-27/

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