Samsung and Broadcom announce plans to collaborate across memory, foundry, and packaging technologies

Samsung Electronics and Broadcom signed a memorandum of understanding for a chip production collaboration potentially worth $200 billion over five years, covering memory, foundry, and advanced packaging technologies. The partnership will focus on high-bandwidth memory for Broadcom's AI accelerators and Samsung's sub-2nm process nodes for higher-performance, power-efficient AI and networking silicon.

Samsung Electronics and Broadcom have sealed a chip production collaboration that could be worth $200 billion over five years. The partners have signed a memorandum of understanding covering joint projects on memory, chip foundry, and advanced packaging technologies. Across memory, Samsung and Broadcom plan to “pursue a strategic collaboration for the supply of industry-leading memory solutions,” including high-bandwidth memory, which will support Broadcom’s next-generation AI accelerators. Meanwhile, across foundry and packaging, the partners’ collaborative efforts will focus on bringing Samsung’s sub-2 nanometer nm process node technologies to Broadcom’s products, and extending advanced packaging solutions built on the 2nm process, including 2.3D and 2.5D integrations. This will enable higher-performance and more power-efficient AI and networking silicon, Samsung said. Young Hyun Jun, vice chairman and CEO of the device solutions division at Samsung Electronics, said: “AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging. By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.” “As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important,” added Charlie Kawwas, president of the semiconductor solutions group at Broadcom. “By combining Samsung’s memory and foundry expertise with Broadcom’s AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure.”