Qualcomm and Amazon connect on AI silicon

Qualcomm Technologies, Inc. announced a multi-generation collaboration with Amazon to develop customized silicon for AWS's AI infrastructure, including optical connectivity solutions up to 1.6Tbit/s. The partnership aims to address growing AI workload demands by combining Amazon's AI infrastructure with Qualcomm's power-efficient processing and silicon design expertise, and Qualcomm will also use AWS AI services like Amazon Bedrock for chip design workloads.

Featured Story Nokia plans sweeping Bell Labs cuts to alarm of ex-president Former Bell Labs boss Marcus Weldon weighs in with new harsh criticism of Nokia leadership as the famous research unit falls victim to more cuts. Qualcomm and Amazon are working together on customized silicon for AWS's AI infrastructure, including optical connectivity up to 1.6Tbit/s. pressrelease September 8, 2026 Qualcomm Technologies, Inc. NASDAQ: QCOM today announced a multi-generation collaboration with Amazon to enable customized silicon at scale for large-scale AI data centers, working together on AI inference. In addition, the companies are working on optical connectivity solutions extending up to 1.6T and future-generation solutions. As AI workloads grow exponentially — driving unprecedented demand for compute, storage, networking and memory bandwidth, and energy-efficient infrastructure — the collaboration brings together Amazon's comprehensive, secure, and price-performant AI infrastructure with Qualcomm Technologies' leadership in power-efficient processing, silicon design and system-level integration. Qualcomm Technologies and Amazon will also collaborate on high-performance optical connectivity solutions designed to support the growing scale and bandwidth demands of AI infrastructure. The collaboration will leverage Qualcomm Technologies' advanced SerDes and optical DSP technologies. As part of the expanded collaboration, Qualcomm Technologies plans to deepen its use of AWS AI infrastructure, including Amazon Bedrock, for electronic design automation EDA workloads, targeting a reduction in chip design cycles. "As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency," said Cristiano Amon, President and CEO, Qualcomm Incorporated. "Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure." Read the full press release here. https://www.qualcomm.com/news/releases/2026/09/qualcomm-announces-multi-generational-product-collaboration-with