Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line Memory Module (MRDIMM) chipset solutions, delivering DDR5 server-class MRDIMM speeds up to 16,000 mega transfers per second (MT/s). The new solutions are designed to address the growing demand for higher memory bandwidth driven by artificial intelligence (AI) data centers, cloud infrastructure and accelerated compute workloads.
Renesas will showcase memory interface components for Gen 3 MRDIMMs at FMS 2026 (Future of Memory and Storage Conference), Santa Clara, California, August 4-6, 2026. (Booth #807) They include third-generation Multiplexed Registering Clock Driver (MRCD, RRG5013) and Multiplexed Data Buffer (MDB, RRG5103) devices that support next-generation MRDIMM performance.