(PR) Lexar Shows New AI Storage Core Technologies and Storage for Specialized Application Environments at IFA 2026

Lexar showcased its next-generation AI Storage Core technologies at IFA 2026, including AI-grade Gen 5 SSD and Gen 5 Storage Stick concepts with bandwidth up to 11 GB/s, designed to support compact AI devices requiring larger local model storage and faster model switching. The architecture integrates Longsys' self-developed Gen 5 controller SPU, manufactured on a 5 nm process with a DRAM-less design, and Lexar Luma Bridge technologies, which reduce DRAM capacity requirements by approximately 40%.

Beyond portable storage, Lexar is also showcasing the continued evolution of its AI Storage Core at IFA 2026. Combining advanced packaging, chip hardware, Lexar Luma Bridge technologies, and system-level optimization, the showcase includes next-generation AI-grade Gen 5 SSD and AI-grade Gen 5 Storage Stick. With bandwidth of up to 11 GB/s, these concepts support compact AI devices requiring larger local model storage, faster model switching, lower-latency data access, and sustained performance within constrained power and thermal environments. Underpinning these concepts is an integrated hardware-software architecture built around Longsys' self-developed Gen 5 controller SPU, or Storage Processing Unit, and Lexar Luma Bridge technologies. Manufactured on an advanced 5 nm process with a DRAM-less architecture, the SPU is engineered to improve supply stability while maintaining high-performance AI storage capabilities. Lexar Luma Bridge uses intelligent workload scheduling, predictive prefetch, and optimized cache management to address large Mixture-of-Experts models, expanding KV Cache, and I/O latency—improving local AI performance while reducing DRAM capacity requirements by approximately 40%.