AMD today announced the AMD Versal Premium Gen 2 Memory on Package (MoP) adaptive system-on-chips (SoCs). The MoP architecture integrates up to 32 GB of LPDDR5X into a single package, delivering up to 288 GB/s of bandwidth in up to 60% less board area, letting engineers build high-bandwidth systems without the risk and time of board-level memory design. As physical AI, networking, and aerospace and defense workloads push more data through ever-tighter space and power budgets, MoP targets the designs that need it most: test and measurement, professional video editing, and VPX systems for secure communications and defense acceleration.
"For years, system architects had to choose between the memory bandwidth they wanted and the space, power and longevity their programs could actually live with. Memory on Package removes that tradeoff. Our customers can design for the system they want to build, not the one their memory constraints allow, and bring it to market faster."—Sumit Shah, head of product management and marketing, Adaptive and Embedded Computing Group, AMD