# OPC Global Summit: News spans AI-optimized hardware, cooling equipment > Source: > Published: 2026-10-15 14:04:47+00:00 The [OCP Global Summit](https://www.opencompute.org/events/ocp-summit/2026-ocp-global-summit/) is taking place this week in San Jose, Calif., and the news is flowing. The summit is an annual conference of the [Open Compute Project](https://www.opencompute.org/events/ocp-summit/2026-ocp-global-summit/), an industry initiative focused on developing more open, efficient, and scalable hardware designs for data centers and other computing infrastructure. The summit covers the physical infrastructure behind cloud computing and AI data centers, including AI servers and accelerators, standardized or openly-shared designs for hardware, power and cooling, and networking and connectivity. Here is a rundown of some of the announcements so far. Nvidia submitted key rack and compute tray designs for its [Vera Rubin](https://www.networkworld.com/article/4188058/nvidia-unveils-vera-rubin-platform-targeting-ai-hpc-infrastructure-customers.html) platform to the Open Compute Project through its modular MGX architecture. The goal is to give server vendors and other infrastructure suppliers a shared design foundation for building AI systems. One feature that distinguishes Nvidia’s rack and tray designs is that there are no fans or cabling because everything is liquid cooled. This makes them easy to deploy and service. Arm released a white paper, developed with partners, that proposes a use-case-driven methodology for measuring the CPU’s contribution to agentic AI systems. It defines five representative workload types—software engineering, enterprise operations, financial and scientific research, personal assistants, and robotics—and pairs component-level benchmarking with end-to-end task measurement built on re-playable agent trajectories. Arm also highlighted independent testing by Signal65 that found its AGI CPU could deliver up to twice the rack-level performance of AMD’s Epyc Turin generation server processors across select agentic AI workloads. The comparison emphasizes completed work under rack-level constraints rather than conventional CPU benchmarks alone. In the testing, an Arm AGI CPU averaged 1.7x better performance for tooling, 2.0x for agentic workflows and orchestration, and 2.2x for reasoning and planning in modeled per-rack performance versus an AMD Epyc Turin processor. Arm’s AGI CPU reduces sandbox creation latency by up to 45% versus AMD Epyc 9965, helping agents spin up isolated execution environments faster, according to Arm. Kioxia unveiled its LD4 Series enterprise solid-state drives (SSD), designed to increase flash storage density in hyperscale data centers and high density 1U servers. The drives target read-intensive workloads, including data storage applications supporting artificial intelligence infrastructure. The new SSDs offer eighth-generation BiCS FLASH 3D quad-level cell (QLC) NAND technology with capacities of 15.36TB and 30.72TB, with a validated architecture designed to support capacities of up to 122.88TB. The drives support PCIe 5.0 and NVMe 2.0e, along with the Open Compute Project’s Datacenter NVMe SSD Specification 2.6. They feature a single-port design for hyperscale and data center-class servers. Kioxia said the LD4 Series is currently sampling to select customers. Cooler Master, a company best known for providing liquid cooling to gamer systems, is bringing that experience to the data center. It is expanding its end-to-end liquid-cooling portfolio for AI data centers, highlighting a 2,500 kW liquid-to-liquid coolant distribution unit (CDU) designed for high-density AI and HPC infrastructure. The system supports coolant flow rates of up to 990 gallons per minute and features dual-system architecture, intelligent load balancing, and centralized management for as many as 32 interconnected CDUs, according to the vendor. Mass production is targeted for the fourth quarter of 2026. Cooler Master’s expanded portfolio is aimed at data center operators building new AI facilities as well as those retrofitting existing sites to accommodate increasing rack densities and thermal demands. Flex announced an expansion of its prefabricated modular data center portfolio with integrated systems designed to accelerate deployment of AI infrastructure by as much as 50% compared with traditional construction methods. The new AI Modules combine power delivery, high-density computing, and advanced liquid cooling in factory-built systems. This approach shifts much of the integration and testing work from the data center construction sites to Flex, the company says. The systems include an 800-volt direct-current (800 VDC) power rack for power conversion and distribution, cooling distribution units (CDU) to manage heat from power-intensive AI workloads, and high-density IT racks incorporating AI servers, networking equipment, and high-speed interconnects. The expanded portfolio is part of Flex’s cloud and power infrastructure business, which the company plans to spin off as an independent, publicly-traded company (Axiom Solutions International) in the first quarter of 2027.