# Nvidia CEO Meets SK Group Chairman to Discuss AI Memory Cooperation

> Source: <https://letsdatascience.com/news/nvidia-ceo-meets-sk-group-chairman-to-discuss-ai-memory-coop-75b424b2>
> Published: 2026-06-02 23:20:29.502794+00:00

# Nvidia CEO Meets SK Group Chairman to Discuss AI Memory Cooperation

Nvidia CEO Jensen Huang met SK Group Chairman Chey Tae-won in Taipei on June 1, according to a post on SK Group's Facebook account reported by Yonhap. The meeting, held on the sidelines of Computex, covered cooperation on artificial intelligence memory and marked a celebration of SK hynix reaching a market capitalization of **US$1 trillion**, the Facebook post said, quoted by Yonhap. Yonhap also reports Huang visited SK hynix's booth, inspected next-generation high-bandwidth memory products, and left handwritten notes on sample wafers reading "Please make more" and "Love SOCAMM." Yonhap reports that SK hynix supplies Nvidia with **HBM4** and that Nvidia has begun mass production of the Vera Rubin AI computing platform equipped with HBM4. Editorial analysis: Industry observers note that senior executive meetings like this reflect the tight supplier integraton around HBM and the premium placed on memory capacity for large AI models.

### What happened

Jensen Huang, chief executive officer of **Nvidia Corp.**, met with **SK Group** Chairman Chey Tae-won in Taipei on June 1, according to a post on SK Group's Facebook account cited by Yonhap. The Facebook post, as reported by Yonhap, said the executives met to mark **SK hynix** reaching a market capitalization of **US$1 trillion** and to discuss future cooperation in artificial intelligence memory. Yonhap reports Huang visited **SK hynix**'s Computex booth to review next-generation high-bandwidth memory samples and left handwritten notes on wafers, writing "Please make more" on an **HBM4E** sample and "Love SOCAMM" on a SOCAMM module.

### Technical details

Per Yonhap, **SK hynix** supplies **HBM4** to **Nvidia**, and Yonhap reports Huang confirmed that Nvidia has begun mass production of the Vera Rubin AI computing platform, which is equipped with HBM4. Industry-pattern observations: High-bandwidth memory such as **HBM4** is a concentrated critical input for large-scale GPU systems because it combines high throughput with lower power per bit, a factor that materially affects AI data center throughput and model scaling.

### Industry context

Editorial analysis: Companies building large AI accelerators and data centers have increasingly limited vendor options for next-generation HBM, creating tight supplier relationships between GPU designers and memory manufacturers. Observers following the sector note that executive-level coordination at trade shows is a common mechanism to align product timing, validate samples, and highlight marquee partnerships to investors and customers.

### Related events reported

Yonhap, citing industry sources, reports Huang plans a trip to Seoul later in the week with scheduled meetings with major South Korean conglomerate leaders, including LG Group Chairman Koo Kwang-mo and Naver founder Lee Hae-jin, and potential participation by Hyundai Motor Group Executive Chair Euisun Chung. Yonhap also reports a planned closed-door meeting with local robotics and AI startups and a meeting with Kim Taek-jin, CEO of NC Corp.

### What to watch

For practitioners: monitor the following indicators to judge downstream implications:

- •Announcements from
**SK hynix** or**Nvidia** about HBM4 supply agreements, capacity expansions, or qualification milestones. - •Capacity and pricing signals in the memory market, especially for
**HBM4** and advanced module supply. - •Productization timelines for large-scale systems using Vera Rubin, since system ship schedules drive near-term demand for HBM.
- •Any formal statements or filings from the companies that detail supply commitments or joint development programs.

Editorial analysis: For engineers and infrastructure planners, these kinds of supplier-level alignments tend to affect procurement lead times and benchmarking expectations for new AI hardware generations, which in turn shape model deployment timelines and cost assumptions.

## Scoring Rationale

This is a notable infrastructure story because HBM supply is a constraining input for large AI systems and the meeting signals continued coordination between a major GPU vendor and a memory supplier. The story is company-level and relevant for capacity planning, but it does not by itself announce new contracts or capacity expansions.

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