Murata’s iPaS Substrates: Solving the Power Delivery Bottleneck in AI Accelerators

Murata Manufacturing, the world's largest producer of Multi-Layer Ceramic Capacitors (MLCCs), plans to mass-produce its Integrated Package Solution (iPaS) next year, integrating passive components such as capacitors and inductors into a multi-layer power substrate to support Vertical Power Delivery (VPD) architectures for AI accelerators. Murata's iPaS aims to reduce power loss and free up surface space on chip packages by moving power delivery closer to, or beneath, the chip as AI accelerator current and power consumption rise.

Murata’s iPaS Substrates: Solving the Power Delivery Bottleneck in AI Accelerators Murata Manufacturing, the world's largest producer of Multi-Layer Ceramic Capacitors MLCCs , plans to mass-produce its Integrated Package Solution iPaS next year. AsiaAI Publisher · September 14, 2026 · 2 min read · Source: 科技新報 TechNews · Issue 96 East Asian Technology Intelligence Japan & China tech news — translated, contextualized, and delivered for Western readers. Free. Unsubscribe anytime. This story ran in Issue 96, alongside three other stories. Semiconductors & Hardware Murata Manufacturing, the world’s largest producer of Multi-Layer Ceramic Capacitors MLCCs , plans to mass-produce its Integrated Package Solution iPaS next year. iPaS integrates passive components like capacitors and inductors into a multi-layer power substrate to support Vertical Power Delivery VPD architectures for AI accelerators, aiming to reduce power loss and free up surface space on chip packages. As AI accelerator performance increases, so does power consumption and current, making efficient power delivery critical. Traditional power modules around the chip lead to longer paths and greater resistance loss. Murata’s iPaS addresses this by moving power delivery closer, even beneath the chip, aligning with the industry’s need for advanced packaging solutions that can handle high current and thermal demands.