Kintron Technology Expands Glass Substrates to Solve the AI Packaging and CPO Bottleneck

Taiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging and co-packaged optics (CPO), highlighting its 12-inch TGV glass substrates, fiber array units (FAU), and 'Nice Lady' technologies. The company emphasizes the consistency of high aspect ratio through-holes in thick glass as a key differentiator for high-density interconnects, addressing bottlenecks in AI chip packaging and optical interconnects for next-generation AI accelerators.

Kintron Technology Expands Glass Substrates to Solve the AI Packaging and CPO Bottleneck Taiwanese firm Kintron Technology is expanding its Through Glass Via TGV substrate and glass micro-processing technologies for AI advanced packaging and co-packaged optics CPO . AsiaAI Publisher · September 3, 2026 · 2 min read · Source: 科技新報 TechNews Semiconductors & Hardware Taiwanese firm Kintron Technology is expanding its Through Glass Via TGV substrate and glass micro-processing technologies for AI advanced packaging and co-packaged optics CPO . The company highlighted its 12-inch TGV glass substrates, fiber array units FAU , and ‘Nice Lady’ technologies, emphasizing the consistency of high aspect ratio through-holes in thick glass as a key differentiator for high-density interconnects. As AI chips grow larger and demand higher data transfer rates, advanced packaging materials and optical interconnects are critical bottlenecks. Kintron’s glass-based solutions address the need for greater flatness, dimensional stability, and high-density electrical and optical connections for next-generation AI accelerators, which Western chip designers and data centers are heavily reliant on.