# Kintron Technology Expands Glass Substrates to Solve the AI Packaging and CPO Bottleneck > Source: > Published: 2026-09-03 09:00:00+00:00 Kintron Technology Expands Glass Substrates to Solve the AI Packaging and CPO Bottleneck Taiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging and co-packaged optics (CPO). AsiaAI Publisher · September 3, 2026 · 2 min read · Source: 科技新報 TechNews Semiconductors & Hardware Taiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging and co-packaged optics (CPO). The company highlighted its 12-inch TGV glass substrates, fiber array units (FAU), and ‘Nice Lady’ technologies, emphasizing the consistency of high aspect ratio through-holes in thick glass as a key differentiator for high-density interconnects. As AI chips grow larger and demand higher data transfer rates, advanced packaging materials and optical interconnects are critical bottlenecks. Kintron’s glass-based solutions address the need for greater flatness, dimensional stability, and high-density electrical and optical connections for next-generation AI accelerators, which Western chip designers and data centers are heavily reliant on.