{"slug": "kintron-technology-expands-glass-substrates-to-solve-the-ai-packaging-and-cpo", "title": "Kintron Technology Expands Glass Substrates to Solve the AI Packaging and CPO Bottleneck", "summary": "Taiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging and co-packaged optics (CPO), highlighting its 12-inch TGV glass substrates, fiber array units (FAU), and 'Nice Lady' technologies. The company emphasizes the consistency of high aspect ratio through-holes in thick glass as a key differentiator for high-density interconnects, addressing bottlenecks in AI chip packaging and optical interconnects for next-generation AI accelerators.", "body_md": "Kintron Technology Expands Glass Substrates to Solve the AI Packaging and CPO Bottleneck\n\nTaiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging and co-packaged optics (CPO).\n\nAsiaAI Publisher\n·\nSeptember 3, 2026 ·\n2 min read · Source: 科技新報 TechNews\n\nSemiconductors & Hardware\n\nTaiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging and co-packaged optics (CPO). The company highlighted its 12-inch TGV glass substrates, fiber array units (FAU), and ‘Nice Lady’ technologies, emphasizing the consistency of high aspect ratio through-holes in thick glass as a key differentiator for high-density interconnects.\n\nAs AI chips grow larger and demand higher data transfer rates, advanced packaging materials and optical interconnects are critical bottlenecks. Kintron’s glass-based solutions address the need for greater flatness, dimensional stability, and high-density electrical and optical connections for next-generation AI accelerators, which Western chip designers and data centers are heavily reliant on.", "url": "https://wpnews.pro/news/kintron-technology-expands-glass-substrates-to-solve-the-ai-packaging-and-cpo", "canonical_source": "https://asiaai.fyi/kintron-glass-substrates-ai-packaging-cpo/", "published_at": "2026-09-03 09:00:00+00:00", "updated_at": "2026-09-03 15:24:44.227760+00:00", "lang": "en", "topics": ["ai-infrastructure", "ai-chips", "ai-products"], "entities": ["Kintron Technology"], "alternates": {"html": "https://wpnews.pro/news/kintron-technology-expands-glass-substrates-to-solve-the-ai-packaging-and-cpo", "markdown": "https://wpnews.pro/news/kintron-technology-expands-glass-substrates-to-solve-the-ai-packaging-and-cpo.md", "text": "https://wpnews.pro/news/kintron-technology-expands-glass-substrates-to-solve-the-ai-packaging-and-cpo.txt", "jsonld": "https://wpnews.pro/news/kintron-technology-expands-glass-substrates-to-solve-the-ai-packaging-and-cpo.jsonld"}}