As artificial intelligence systems demand ever more computing power, a team of Korean researchers says it has found a way to tackle one of the industry’s most expensive and stubborn problems: heat. Researchers at the Korea Advanced Institute of Science and Technology said Tuesday they have developed a liquid cooling technology capable of reducing the power needed for semiconductor cooling to roughly one-tenth of current levels while delivering significantly higher efficiency. The team said the technology integrates microscopic cooling channels, thinner than a human hair, directly into semiconductor chips and combines them with a manifold structure that distributes coolant through multiple pathways. The design is intended to shorten the distance coolant must travel, reducing energy losses while improving heat removal. Researchers said previous manifold microchannel cooling systems often suffered from uneven coolant distribution, with some channels receiving more flow than others. To address that problem, the team optimized the structure so that coolant moves more evenly throughout the sy
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