{"slug": "huaweis-new-kirin-chip-puts-logicfolding-to-the-test-with-bigger-ambitions-in-ai", "title": "Huawei’s new Kirin chip puts LogicFolding to the test, with bigger ambitions in AI", "summary": "Huawei Technologies launched the Kirin 9050 Pro, the first commercial chip using its LogicFolding architecture, which stacks circuits to boost performance without advanced lithography, delivering a 42% performance leap in the Mate XT 2 smartphone. Analysts say the chip is a high-stakes test of Huawei's ability to bypass US sanctions, though the approach may be less economical for chipmakers with access to leading-edge equipment.", "body_md": "# Huawei’s new Kirin chip puts LogicFolding to the test, with bigger ambitions in AI\n\nNew smartphone processor is a crucial test of the firm’s attempt to route around US-led curbs on the best chipmaking technology\n\n[Howard Liu](/author/howard-liu)in Beijing\n\n[Huawei Technologies](https://www.scmp.com/topics/huawei?module=inline&pgtype=article)’ latest flagship mobile processor is serving as a high-stakes test of whether the company can bypass US technology sanctions by layering circuits on top of each other to boost performance, according to analysts.\n\n[launched the Kirin 9050 Pro](https://www.scmp.com/tech/tech-trends/article/3366650/huawei-unveils-new-trifold-smartphone-powered-tau-scaling-law-based-kirin-chip?module=inline&pgtype=article), the first commercial chip employing its\n\n[LogicFolding architecture](https://www.scmp.com/tech/big-tech/article/3366543/huawei-paper-shows-tau-scaling-law-chip-solves-overheating-ahead-kirin-2026-launch?module=inline&pgtype=article). The new strategy aims to squeeze greater computing power out of semiconductor designs without relying solely on the circuit-shrinking provided by the world’s most advanced lithography equipment, which remains blocked by US export controls.\n\nPowering Huawei’s new Mate XT 2 trifold smartphone, the Kirin 9050 Pro delivers a 42 per cent leap in overall performance over its predecessor alongside improved power efficiency, according to the company.\n\nFor global chipmakers with access to leading-edge manufacturing equipment, stacking components – or 3D integration – is typically a supplementary tool used alongside transistor miniaturisation. Constrained by trade restrictions, however, Huawei has instead made advanced packaging and architectural workarounds its main strategy.\n\nWhile existing 3D techniques simply stack largely self-contained dies, Huawei’s LogicFolding splits core computing functions across two active layers designed to operate as a single unit.\n\n“LogicFolding is first and foremost a compensatory route – a choice born of external constraints,” said Leslie Wu, CEO of semiconductor consultancy RHCC, in a research note.\n\nWu said the approach came at a cost. Bonding two active silicon layers requires complex manufacturing steps – including precise wafer thinning and microscopic vertical wiring – that can weigh on factory yields. For global companies that can simply print smaller transistors on a single layer, the economics of LogicFolding may be less compelling.", "url": "https://wpnews.pro/news/huaweis-new-kirin-chip-puts-logicfolding-to-the-test-with-bigger-ambitions-in-ai", "canonical_source": "https://www.scmp.com/tech/big-tech/article/3366669/huaweis-new-kirin-chip-puts-logic-folding-test-bigger-ambitions-ai?utm_source=rss_feed", "published_at": "2026-09-08 02:00:18+00:00", "updated_at": "2026-09-08 02:31:40.602787+00:00", "lang": "en", "topics": ["ai-chips", "artificial-intelligence"], "entities": ["Huawei Technologies", "Kirin 9050 Pro", "LogicFolding", "Mate XT 2", "Leslie Wu", "RHCC"], "alternates": {"html": "https://wpnews.pro/news/huaweis-new-kirin-chip-puts-logicfolding-to-the-test-with-bigger-ambitions-in-ai", "markdown": "https://wpnews.pro/news/huaweis-new-kirin-chip-puts-logicfolding-to-the-test-with-bigger-ambitions-in-ai.md", "text": "https://wpnews.pro/news/huaweis-new-kirin-chip-puts-logicfolding-to-the-test-with-bigger-ambitions-in-ai.txt", "jsonld": "https://wpnews.pro/news/huaweis-new-kirin-chip-puts-logicfolding-to-the-test-with-bigger-ambitions-in-ai.jsonld"}}