{"slug": "google-in-talks-with-samsung-to-make-chip-component", "title": "Google in Talks with Samsung to Make Chip Component", "summary": "Alphabet's Google is in talks with Samsung Electronics to manufacture a component of its next-generation AI tensor processing unit, codenamed Icefish, according to a report by The Information cited by Reuters on June 11, 2026. Under the proposed plan, TSMC would produce the main compute die while Samsung would manufacture a memory-interface component using 2-nanometer process technology, with mass production potentially beginning as early as 2028. The discussions follow Google's reported talks with Intel for additional manufacturing and come after Samsung secured a deal to make AI chips for Tesla, though Reuters noted it could not independently verify the report.", "body_md": "# Google in Talks with Samsung to Make Chip Component\n\nThe Information reported that Alphabet's Google is discussing with **Samsung Electronics** to manufacture a component of its next-generation AI tensor processing unit, codenamed Icefish, Reuters reported on June 11, 2026. According to the report cited by Reuters, **TSMC** would make the main compute die while Samsung would produce a component that links the compute die to memory using 2-nanometer process technology. The Information said Google is working with **MediaTek** on the design and that mass production could be possible as early as **2028**. Reuters noted it could not independently verify the report; Samsung declined to comment and Alphabet did not immediately respond, per Reuters. The story follows recent reporting that Google has also discussed additional manufacturing with **Intel**, and sits alongside Samsung's recent win to make AI chips for **Tesla**, Reuters added.\n\n### What happened\n\nThe Information reported that Alphabet's Google is in talks with **Samsung Electronics** to manufacture part of its next-generation AI tensor processing unit, codenamed Icefish, Reuters reported on June 11, 2026. Reuters, citing The Information and two people familiar with the matter, said **TSMC** would make the main compute portion while Samsung would produce a component that connects the compute die to memory using 2-nanometer process technology. The Information, via Reuters, also reported that Google is working with **MediaTek** on chip design and that mass production could be possible as early as **2028**. Reuters said it could not independently verify the report; Samsung declined to comment and Alphabet did not immediately respond.\n\n### Technical details\n\nPer reporting in The Information and Reuters, the work is split between a main compute die (assigned to **TSMC**) and a memory-interface or interposer-like component slated for Samsung's 2-nanometer nodes. The story frames this as a multi-vendor manufacturing approach rather than a single-foundry build. Reuters also referenced earlier coverage that Google has discussed producing TPUs with **Intel** and has recently released new internal chips for training and inference.\n\n### Editorial analysis\n\nCompanies building custom AI accelerators routinely split complex designs across multiple foundries and fabs to manage capacity, mix process-node strengths, and diversify supply risk. Using a specialist foundry for the main compute die while using another for a memory-interface component aligns with patterns seen in high-performance chip supply chains.\n\n### Context and significance\n\nDiversifying manufacturing partners matters because foundry capacity constraints at leading nodes have become a material bottleneck for the AI hardware supply chain. Samsung securing a role on a Google TPU program would mark a notable commercial win for Samsung's contract-manufacturing push at advanced nodes, following Reuters reporting that Samsung won a Tesla order and is considering a second Texas plant to expand 2-nanometer capacity.\n\n### What to watch\n\nFor practitioners: follow verification and vendor confirmations, any published technical disclosures about Icefish partitioning, and capacity-timeline signals from Samsung, TSMC, and Intel. Also watch for supply agreements or public statements that clarify which die functions each foundry will deliver and whether mass production targets near **2028** hold.\n\n## Scoring Rationale\n\nThe story matters to ML infrastructure teams because it signals potential diversification of advanced-node TPU manufacturing, which affects supply capacity and procurement planning. The report is notable but not definitive: it is based on reporting rather than confirmed vendor announcements.\n\nPractice with real Ad Tech data\n\n90 SQL & Python problems · 15 industry datasets\n\n[Active Search Campaigns by BudgetEasy](/problems/sql/active-search-campaigns-by-budget)\n\n[High CPC Clicks & Poor Landing PagesMedium](/problems/sql/high-cpc-clicks-poor-landing-page)\n\n[Campaign ROAS by Attribution ModelHard](/problems/sql/campaign-roas-by-attribution-model)\n\n250 free problems · No credit card\n\n[See all Ad Tech problems](/problems/datasets/adtech)", "url": "https://wpnews.pro/news/google-in-talks-with-samsung-to-make-chip-component", "canonical_source": "https://letsdatascience.com/news/google-in-talks-with-samsung-to-make-chip-component-eaa461b6", "published_at": "2026-06-11 17:49:45.397418+00:00", "updated_at": "2026-06-11 17:49:49.354677+00:00", "lang": "en", "topics": ["ai-chips", "artificial-intelligence", "ai-infrastructure"], "entities": ["Google", "Samsung Electronics", "TSMC", "MediaTek", "Intel", "Tesla", "Icefish", "Reuters"], "alternates": {"html": "https://wpnews.pro/news/google-in-talks-with-samsung-to-make-chip-component", "markdown": "https://wpnews.pro/news/google-in-talks-with-samsung-to-make-chip-component.md", "text": "https://wpnews.pro/news/google-in-talks-with-samsung-to-make-chip-component.txt", "jsonld": "https://wpnews.pro/news/google-in-talks-with-samsung-to-make-chip-component.jsonld"}}