China’s JCET to build new plant in Shanghai to expand advanced chip packaging

China's JCET announced a $1.15 billion investment to build an advanced chip packaging and testing plant in Shanghai's Lin-gang Special Area, aiming to boost domestic chipmaking capabilities amid rising AI demand and US export restrictions. The project, to be completed in phases by 2028, will expand advanced-packaging capacity and enhance JCET's competitiveness.

China’s JCET to build new plant in Shanghai to expand advanced chip packaging US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development demand for home-grown chips https://www.scmp.com/tech/big-tech/article/3344610/why-sj-semiconductor-matters-chinas-race-build-home-grown-ai-chips?module=inline&pgtype=article continues to surge amid the rapid development of artificial intelligence. A controlled subsidiary with a registered capital of 4 billion yuan would be set up to construct an advanced packaging and testing factory in the Lin-gang Special Area in Shanghai, the company said on Wednesday. The project will be rolled out in two phases, with the first – covering factory construction and equipment investment – scheduled for completion in the second half of 2028. advanced-packaging capacity https://www.scmp.com/tech/tech-war/article/3358078/asml-euv-china-rumour-ridiculed-it-reveals-tougher-reality-ground?module=inline&pgtype=article and enhancing the company’s overall competitiveness. Advanced packaging – the final step in chip production that involves assembling individual dies into finished products – has become critical to China’s chipmaking capabilities, especially as Washington’s export controls restrict access to advanced manufacturing foundries such as Taiwan Semiconductor Manufacturing Company. JCET’s Shanghai-listed shares have surged 147 per cent since the beginning of the year on the back of strong growth.