US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development
demand for home-grown chipscontinues to surge amid the rapid development of artificial intelligence.
A controlled subsidiary with a registered capital of 4 billion yuan would be set up to construct an advanced packaging and testing factory in the Lin-gang Special Area in Shanghai, the company said on Wednesday.
The project will be rolled out in two phases, with the first – covering factory construction and equipment investment – scheduled for completion in the second half of 2028.
advanced-packaging capacityand enhancing the company’s overall competitiveness.
Advanced packaging – the final step in chip production that involves assembling individual dies into finished products – has become critical to China’s chipmaking capabilities, especially as Washington’s export controls restrict access to advanced manufacturing foundries such as Taiwan Semiconductor Manufacturing Company.
JCET’s Shanghai-listed shares have surged 147 per cent since the beginning of the year on the back of strong growth.