# ASMPT CEO Robin Ng says chip architecture will keep evolving as AI demands more silicon > Source: > Published: 2026-07-29 12:30:34+00:00 Via semi.asmpt.com # ASMPT CEO Robin Ng says chip architecture will keep evolving as AI demands more silicon The semiconductor packaging giant is riding AI tailwinds as multi-chip architectures drive demand for its advanced bonding tools ASMPT Group CEO Robin Ng laid this out plainly in a Bloomberg interview on July 29, saying chip architecture will continue to evolve as newer AI systems use more chips. For a company that specializes in semiconductor assembly and packaging, that’s less of a prediction and more of a business forecast. ## The packaging play nobody’s talking about enough Most AI hardware conversations fixate on chip designers like Nvidia or AMD. The companies that physically put those chips together get far less attention. ASMPT, headquartered in Singapore, is one of the largest players in back-end semiconductor packaging, the stage where individual chips get assembled into the multi-chip modules that power data centers. The company’s key product in this AI boom is its thermo-compression bonding tools, known as TCB tools. These machines are essential for connecting chips in the tight, precise configurations that AI and high-performance computing applications require. In December 2025, ASMPT secured orders for 19 chip-to-substrate TCB tools specifically built for AI and HPC applications. In July 2025, the company reported better-than-expected bookings across both its advanced packaging and mainstream business segments. The company attributed the outperformance to “AI tailwinds” driven by data center expansions. ## Why multi-chip architectures matter ASMPT’s product portfolio is positioned squarely for this trend. The company offers chip-on-wafer and chip-on-substrate solutions, both of which are critical for assembling multi-chip packages. The company is pushing further into the frontier through a collaboration with IBM Research aimed at developing next-generation AI chip technology. ## What this means for investors Ng made another point in his interview that deserves attention. He noted that the introduction of cheaper, more accessible AI models could actually increase long-term demand for AI chips rather than reduce it. The logic is counterintuitive but sound. When AI becomes cheaper to deploy, more companies deploy it. More deployments mean more inference workloads. More inference workloads mean more chips. More chips mean more packaging. The December 2025 TCB tool orders and the strong first-half 2025 bookings suggest the company is in the early innings of a sustained demand cycle. **Disclosure:** This article was edited by Editorial Team. For more information on how we create and review content, see our [Editorial Policy](https://cryptobriefing.com/editorial-policy/).