# Aisin and Tohoku University Build 16nm AI Chip Using Embedded STT-MRAM to Cut Inference Power > Source: > Published: 2026-11-07 16:13:03+00:00 East Asian Technology Intelligence Tech news from Japan, China, Korea & Taiwan — translated, contextualized, and delivered for Western readers. Free. Unsubscribe anytime. This story ran in [Issue #149](https://asiaai.fyi/mediatek-ai-asic-revenue-cloud-accelerators/), alongside three other stories. Semiconductors & Hardware What happened Tohoku University and Aisin have developed an AI chip featuring embedded **STT-MRAM** that eliminates external DRAM and SSDs through **near-memory computing**. The architecture accelerates OS boot times by roughly 39 times, cuts object detection inference time to one-tenth, and reduces energy consumption to one-fiftieth compared to conventional designs. Manufactured on [TSMC](https://asiaai.fyi/companies/tsmc/)’s 16nm FinFET process, the SoC integrates a 32MB STT-MRAM array, an AI accelerator, two Arm Cortex-A53 CPU cores, and an Arm Mali-G31 GPU. Key details - Tohoku University and Aisin jointly developed a near-memory computing AI chip featuring embedded STT-MRAM on November 2, 2026. - The chip is manufactured using TSMC’s 16nm FinFET process and integrates a 32MB STT-MRAM block, an AI accelerator, two Arm Cortex-A53 cores, and an Arm Mali-G31 GPU. - The design reduces power-on to OS boot time by approximately 39 times, cuts object detection time to about one-tenth, and lowers energy consumption by a factor of 50. What remains unclear - Volume production schedule and target vehicle models for initial deployment - Wafer pricing and yield economics of integrating STT-MRAM into a 16nm FinFET baseline process - Plans for commercial licensing beyond Aisin’s proprietary automotive applications Source: MONOist (ITmedia) · source published November 6, 2026 Japanese industrial firms are aggressively pursuing edge-AI architectures that bypass memory bandwidth bottlenecks without relying on power-hungry external DRAM. This development underscores how traditional automotive suppliers like Aisin are vertically integrating specialized silicon to meet the rigorous latency and thermal constraints of software-defined vehicles. For the wider picture, see [Japan Semiconductor Ecosystem](https://asiaai.fyi/guides/japan-semiconductor-ecosystem/). Original source (Japanese) 世界初「STT-MRAMを搭載した16nm AI SoC」が誕生 SDV推進に向けた動きも加速 Published November 6, 2026 This story appeared in [AsiaAI.FYI Issue #149](https://asiaai.fyi/mediatek-ai-asic-revenue-cloud-accelerators/). Get AsiaAI.FYI in your inbox — [subscribe free](https://asiaaifyi.beehiiv.com/subscribe).