# AI chip race heats up: NVIDIA-SK Group unveil $500 billion alliance as Samsung, Broadcom expand $200 billion partnership > Source: > Published: 2026-07-25 11:47:50+00:00 # AI chip race heats up: NVIDIA-SK Group unveil $500 billion alliance as Samsung, Broadcom expand $200 billion partnership The global race to dominate artificial intelligence infrastructure gathered fresh momentum on Saturday as NVIDIA and South Korea's SK Group announced a semiconductor and AI partnership worth more than $500 billion, while Samsung Electronics and Broadcom expanded their strategic collaboration in a deal estimated to exceed $200 billion through 2030. The two announcements, made within hours of each other, highlight the intensifying competition among the world's biggest chipmakers and technology companies to secure advanced semiconductor manufacturing, AI memory and next-generation computing infrastructure as demand for generative AI continues to surge. ## Greening the Future 23 Jul 2026 - Vol 05 | Issue 30 Securing a sustainable India [Read Now Greening the Future](/magazine/greening-the-future) The larger of the two initiatives will see NVIDIA and SK Group collaborate across AI infrastructure and next-generation memory technologies. As part of the partnership, SK Telecom plans to build a 2-gigawatt NVIDIA Vera Rubin DSX AI Factory in South Korea to meet growing global demand for AI computing capacity. "SK Group and NVIDIA today announced a $500 billion-plus initiative spanning AI factories and next-generation memory," NVIDIA said in a post on X. The partnership also includes collaboration between SK Hynix and NVIDIA to co-develop next-generation AI memory technologies, including High Bandwidth Memory (HBM), a critical component powering AI accelerators and high-performance computing systems. According to NVIDIA, the initiative is designed to strengthen South Korea's position in the global AI ecosystem by combining SK Telecom's data centre capabilities, SK Hynix's leadership in AI memory chips and NVIDIA's AI computing platforms. "Korea is ready to become a global AI powerhouse with world-class networks and data centers, leadership in chip technology and vast industrial scale," the company said. Separately, at the AI Summit in San Francisco, Samsung Electronics and Broadcom signed a memorandum of understanding (MoU) to deepen their collaboration across memory, foundry and advanced semiconductor packaging technologies in a partnership expected to be worth more than $200 billion over the next five years through 2030. The expanded alliance will combine Samsung's expertise in memory, foundry and advanced packaging with Broadcom's AI and connectivity technologies to support next-generation AI infrastructure. On the memory front, Samsung will work with Broadcom to supply advanced memory solutions, including HBM, for Broadcom's next-generation AI accelerators. The companies will also collaborate on Samsung's 2-nanometre (2nm) and below process technologies for Broadcom products, including Wireless Broadband Communications (WBC) solutions. The partnership extends to advanced semiconductor packaging technologies, including 2.3D and 2.5D integration, aimed at improving the performance and power efficiency of AI and networking chips. "AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging," said Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics' Device Solutions Division. "By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future," he added. Charlie Kawwas, President of Broadcom's Semiconductor Solutions Group, said the rapid expansion of AI infrastructure is making deeper collaboration across the semiconductor ecosystem increasingly important. The twin announcements come as technology companies worldwide accelerate investments in AI data centres, advanced chips and semiconductor supply chains to meet soaring demand for generative AI applications. Together, the two partnerships signal that the next phase of the AI race will be driven not just by software breakthroughs, but by massive investments in the hardware ecosystem powering them. *(With inputs from ANI)*