{"type": "article", "title": "SK Hynix Breaks Ground on $4 Billion Indiana AI Chip Packaging Facility", "publisher": "Web Pulse", "url": "https://wpnews.pro/news/sk-hynix-breaks-ground-on-4-billion-indiana-ai-chip-packaging-facility", "original_source": "https://insideai.news/news/ai-hardware-infrastructure/sk-hynix-breaks-ground-on-4-billion-indiana-ai-chip-packaging-facility/9199/", "published": "2026-08-27T15:15:34+00:00", "accessed": "2026-08-27", "id": "sk-hynix-breaks-ground-on-4-billion-indiana-ai-chip-packaging-facility"}