{"type": "article", "title": "Applied Materials, Inc. (AMAT) Partners with Broadcom on Advanced Chip Packaging Technologies for AI Systems", "publisher": "Web Pulse", "url": "https://wpnews.pro/news/applied-materials-inc-amat-partners-with-broadcom-on-advanced-chip-packaging-for", "original_source": "https://finance.yahoo.com/sectors/technology/articles/applied-materials-inc-amat-partners-215026360.html", "published": "2026-05-27T21:50:26+00:00", "accessed": "2026-07-14", "id": "applied-materials-inc-amat-partners-with-broadcom-on-advanced-chip-packaging-for"}